Application Field
Ion Implant Process, Ashing and Etching Process, Epi Process, Some Chemical Vapor Deposition(CVD) Process, For reducing of SiH4 gas, etc.
Characteristic
Appearance
Reaction Mechanism
Gas | Mechanism | TLV (ppm) |
---|---|---|
SiH4 | SiH4 + 2MOH → M2Si + 2H2O + H2 | 5 |