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Applications
- Small devices in front of a vacuum pump to minimize kinetic impacts/momentum of material drops from foreline
- Special designs optimized with processes and materials
Characteristic
- Longer pump lifetime
- Less sudden failures of pumps by foreline drops
- Various designs available to maximize spatial efficiency (→ Optimizing space efficiency with a variety of designs)
- No periodic internal service required
Specification
Category |
Details |
|
|---|---|---|
General |
Model |
KB |
Material |
SUS304 |
|
Size (Inlet) |
ISO160F with ISO100F reducer |
|
Main Functions |
· Fore line device preventing buildup of foreign materials, extending pump life · Conductance-considered designs to maintain process vacuum performance |
|
Main Applications |
Harsh processes in semiconductor manufacturing that generate by-products such as particles, powder, chunks, … (CVDs, ALDs, nitrides, DIFF, some Etches, etc.) |
|
